Kingston HX316C10F/8 HyperX 8G DDR3
DESCRIPTION
HyperX HX316C10FR/8 is a 1G x 64-bit (8GB) DDR3-1600 CL10 SDRAM (Synchronous DRAM) 2Rx8 memory module, based on sixteen 512M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3-1600 at a low latency timing of 10-10-10 at 1.5V. Additional timing parameters are
shown in the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:
PnP JEDEC TIMING PARAMETERS:
DDR3-1600 CL10-10-10 @1.5V
DDR3-1333 CL9-9-9 @1.5V
DDR3-1066 CL7-7-7 @1.5V
Features:
- Dual channel available
- Capacities of up to 8GB (single) and 8GB–16GB (kits)
- Frequency (speed) 1333MHz, 1600MHz, 1866MHz
- CAS latency 9-9-9-27, 10-10-10-30 and 10-11-10-30
- Voltage 1.5V
- Asymmetric heat spreader for stylish heat dissipation
- Compatible with H67, P67, Z68, Z77, Z87 and H61 Intel chipsets, as well as A75, A87, A88, A89, A78 and E35 AMD chipsets
SPECIFICATIONS
CL(IDD) 10 cycles
Row Cycle Time (tRCmin) 48.125ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 37.5ns (min.)
Maximum Operating Power TBD W*
UL Rating 94 V - 0
Operating Temperature :0C to 85
Storage Temperature :-55C to +10C
*Power will vary depending on the SDRAM used.
FEATURES
•JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
•VDDQ = 1.5V (1.425V ~ 1.575V)
•800MHz fCK for 1600Mb/sec/pin
•8 independent internal bank
•Programmable CAS Latency: 11, 10, 9, 8, 7, 6
•Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
•8-bit pre-fetch
•Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
•Bi-directional Differential Data Strobe
•Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
•On Die Termination using ODT pin
•Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE< 95°C
•Asynchronous Reset
•PCB : Height 1.180” (30.00mm), double sided component
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